发明名称 |
LEAD FRAME FOR INTEGRATED CIRCUITS OR THE LIKE AND METHOD OF MANUFACTURE |
摘要 |
A lead frame is provided having a number of leads to be mechanically and electrically connected to a substrate. Retaining members are also provided with the frame to hold the substrate against the leads. The retaining member is preferably disengaged from the substrate simultaneously with the trimming of the leads from the frame after connecting to the substrate. |
申请公布号 |
US5176255(A) |
申请公布日期 |
1993.01.05 |
申请号 |
US19910717681 |
申请日期 |
1991.06.19 |
申请人 |
NORTH AMERICAN SPECIALTIES CORPORATION |
发明人 |
SEIDLER, JACK |
分类号 |
H01L21/68;H01L23/495 |
主分类号 |
H01L21/68 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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