PROCEDE POUR REVETIR DES SUBSTRATS METALLIQUES A L'AIDE D'UN PRIMAIRE EN POUDRE ET D'UN REVETEMENT SUPERFICIEL APPLIQUE PAR TREMPAGE, COMPOSITIONS DE PRIMAIRE EN POUDRE UTILISEES ET MATERIAUX COMPOSITES OBTENUS

摘要

The present invention relates to the field of coatings of metal substrates applied by dipping. It relates to a method of coating a metal substrate using a surface coat applied by dipping after coating of said substrate with a powder primer. It also relates to powder compositions which can be used as adhesion primer, as well as to composite materials: metal substrates/adhesion primer/surface coat.