| 摘要 |
PURPOSE:To prevent the penetrated moisture from the outside from staging in a groove so as to enhance a package in moisture resistance by a method wherein an insulating groove located between a stem protrusion mounted with an element and an insulating frame equipped with an electrode leading-out lead is filled with insulating material. CONSTITUTION:A groove 3 isolating a frame protrusion 2 mounted with a semiconductor element from a ceramic frame 4 which surrounds the protrusion 2 is fully filled with resin after bonding. In a package structure, a ceramic cap 7 is an integral package member and hermetically mounted on a ceramic frame 4 through the intermediary of adhesive agent 11. The three electrodes of a semiconductor element 5 mounted on the frame protrusion 2 function as a source, a drain, and a gate or a collector, a base, and an emitter. By this setup, a semiconductor device package can be sharply enhanced in moisture resistance without changing a joint between a stem and a cap in structure. |
