发明名称 CASE FOR HOUSING AN ELECTRONIC APPARATUS, AND METHOD AND MOLD FOR MOLDING THE CASE
摘要 A case for housing an electronic apparatus has two main portions and a hinge portion which connects the main portions so as to be opened and closed. The case is formed of plastic molding. The hinge portion is formed of a soft resin having a resiliency, and the main portion is formed of a hard resin and integral with the hinge portion. A wiring member for provide an electric connection between the main portions extend through the hinge portion. The wiring member passes at a center of rotation on which the hinge portion is turned.
申请公布号 CA2091504(A1) 申请公布日期 1993.09.13
申请号 CA19932091504 申请日期 1993.03.11
申请人 HITACHI, LTD. 发明人 SATOH, HIDEAKI;ITAKURA, SAKAE;WARAGAI, KENICHI
分类号 B29C45/14;B29C45/26;B29L31/34;E05D1/02;E05D11/00;G06F1/16;G06F1/18;H04B1/38;H04M1/02;H05K3/36;H05K5/02;H05K5/03;H05K7/16;(IPC1-7):H05K5/02;B29C33/00 主分类号 B29C45/14
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