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发明名称
Verfahren zur Bearbeitung der kanten Halbleiterplättchen sowie dazugehörige Apparatur.
摘要
申请公布号
DE3885160(D1)
申请公布日期
1993.12.02
申请号
DE19883885160
申请日期
1988.06.20
申请人
SGS-THOMSON MICROELECTRONICS S.R.L., AGRATE BRIANZA, MAILAND/MILANO, IT
发明人
BERETTA, GIORGIO, I-95128 CATANIA CT, IT;INSERRA, ANTONINO, I-95127 CATANIA CT, IT
分类号
H01L21/205;H01L21/00;H01L21/304;H01L21/306;(IPC1-7):H01L21/306
主分类号
H01L21/205
代理机构
代理人
主权项
地址
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