发明名称 Metal-ceramic structure with intermediate high temperature reaction barrier layer
摘要 A Si-SiC ceramic layer is bonded to a non-porous SiC substrate with the Si etched from the layer to form a relatively porous surface on the otherwise non-porous high strength SiC substrate. A quartz layer is softened by heating and forced into the pores of the porous layer to form a mechanical bond to the SiC substrate. A refractory metal layer is bonded to the quartz layer to complete the joint. A refractory metal support component is then bonded to the refractory layer whereby the quartz serves as a high strength, high temperature reaction barrier between the metal of the refractory layer and the silicon of the SiC substrate.
申请公布号 US5290333(A) 申请公布日期 1994.03.01
申请号 US19920984613 申请日期 1992.12.02
申请人 GENERAL ELECTRIC COMPANY 发明人 NIED, HERMAN F.;MEHAN, RICHARD L.
分类号 B23K20/00;C04B37/02;F28F21/04;F28F21/08;(IPC1-7):C03C27/00 主分类号 B23K20/00
代理机构 代理人
主权项
地址
您可能感兴趣的专利