| 摘要 |
A power device package and the method of fabricating the same are provided to reduce the size of the total package by a laminating structure of substrates. The power device package(10) comprises the first substrate(100), the power semiconductor chip(110), the second substrate(130), the first control semiconductor chip(140), the first and second lead frames(160, 162), and the encapsulating material(170). The first substrate comprises the first side(102) and the second side(104). The power semiconductor chip is mounted on the first side of the first substrate and is electrically connected to the first interconnection pattern(105). The second substrate comprises the second wiring pattern(135). |
