| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing semiconductor device which can reduce the occurrence of failure in crack and external appearance and can also improve productivity. SOLUTION: A wafer 5 is set on a support base 1c provided at the circumferential part of a holder 1, an external circumferential part clamping ring 2 is placed thereon, and the wafer 5 and the external circumferential part clamping ring are pressed with a cover. Since the height L of the support base 1c is set as high as 6 mm if the wafer 5 is warped, the wafer 5 does not contact with the bottom surface 1d of the holder 1 and crack is not caused on the wafer 5. Moreover, since the circumferential part of the wafer 1 is uniformly clamped with the external circumferential part clamping ring, the amount of the warp of the wafer 5 can be reduced and the occurrence of failure in external appearance due to the occurrence of crack and damage can be prevented. COPYRIGHT: (C)2005,JPO&NCIPI |
