发明名称 |
SEMICONDUCTOR CHIP SHAPE ALTERATION |
摘要 |
<p>The invention is directed to an improved semiconductor chip that reduces crack initiation and propagation into the active area of a semiconductor chip. A semiconductor wafer includes dicing channels that separate semiconductor chips and holes through a portion of a semiconductor chip, which are located at the intersection of the dicing channels. Once diced from the semiconductor wafer, semiconductor chips are created without ninety degree angle corners.</p> |
申请公布号 |
EP2095419(A1) |
申请公布日期 |
2009.09.02 |
申请号 |
EP20070865500 |
申请日期 |
2007.12.11 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
FAROOQ, MUKTA, G.;JUNG, DAE-YOUNG;MELVILLE, IAN, D. |
分类号 |
H01L21/78;H01L21/00;H01L23/00;H01L29/06 |
主分类号 |
H01L21/78 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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