STACK PACKAGE

摘要

A stacked package is provided to reduce the size and height by connecting a metal pin passing through the semiconductor package. The connection part is arranged through the stacked semiconductor packages so that stacked semiconductor package(110) is connected. The filler is interposed between semiconductor packages. The outer connection terminal(140) is adhered to the lower part of the semiconductor package arranged. The connection part consists of the metal pin(130). The capping layer(122) is formed in order to cover the connection part on the stacked top part semiconductor chip.