| 摘要 |
<p>A mold reconfigured wafer and a stacked package using the same are provided to make a manufacturing process simple and use a semiconductor chip of general purpose by implementing a stacked package by using a mold reformed wafer without manufacturing a wafer in which a separate device design which considers a penetrating electrode in order to form a stacked package is made. A mold reform phase wafer comprises a plurality of semiconductor chips(410), a mold(440), a penetrating electrode(430) and a rerouting(432). Bonding pads(412) are equipped in a upper side of the semiconductor chips. The mold is formed in order to circle around the side and lower-part of the semiconductor chips. The penetrating electrode is formed in the side mold part of each semiconductor chips. The rerouting is formed in order to connect the bonding pad which is adjacent to the penetrating electrode.</p> |
