发明名称 |
WIRE AND SOLDER BOND FORMING METHODS |
摘要 |
<p>Methods of forming wire and solder bonds are disclosed. In one embodiment, a method includes providing a structure including a wire bond metal region for the wire bond and a solder bond metal region for the solder bond, both regions covered by a silicon nitride layer over a silicon oxide layer; forming in a material a first opening to the silicon oxide layer over the wire bond metal region and a second opening exposing the solder bond metal region; forming the solder bond to the solder bond metal region while the wire bond metal region is covered; exposing the wire bond metal region including removing the silicon oxide layer to the wire bond metal region; and forming the wire bond to the wire bond metal region. Wire bonds and solder bonds can be made accessible on a single multi-part wafer (MPW) or on a single chip, if necessary, and can be formed substantially simultaneously.</p> |
申请公布号 |
EP2095418(A1) |
申请公布日期 |
2009.09.02 |
申请号 |
EP20070822110 |
申请日期 |
2007.10.31 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
DAUBENSPECK, TIMOTHY HARRISON;MUZZY, CHRISTOPHER DAVID;GAMBINO, JEFFREY PETER;SAUTER, WOLFGANG |
分类号 |
H01L23/31;H01L23/485 |
主分类号 |
H01L23/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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