| 摘要 |
<p>A thermal interface material composition including a blend of a polymer matrix and a thermally conductive filler having particles having a maximum particle diameter no greater than about 25 microns, wherein the polymer matrix includes an organopolysiloxane having at least two silicon-bonded alkenyl groups per molecule, an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms per molecule and a hydrosilyation catalyst comprising a transition metal, wherein the transition metal is present in an amount of from about 10 to about 20 ppm by weight based on the weight of the non-filler components and the molar ratio of the silicon-bonded hydrogen atoms to the silicon-bonded alkenyl groups ranges from about 1 to about 2. A method is also provided.</p> |
