MANUFACTURING METHOD OF SEMICONDUCTOR APPARATUS, AND SYSTEM FOR PROCESSING APPLICATION AND DEVELOPMENT OF RESIST

摘要

A method of manufacturing a semiconductor apparatus, and system for processing application and development of resist are provided to reduce the manufacturing cost and improve throughput. The resist layer(3) is formed on the under layer(1). The exposure pattern consisting of the pattern of the disuse layer(3b) and insoluble layer(3a) is formed on the resist layer. The insoluble layer is removed from the resist layer to form the resist pattern(3c). The middle exposure region(3d) is removed from the resist pattern. The new insoluble layer(3e) is formed in the surface of the resist pattern in which reactant is introduced. The new insoluble layer is removed from the resist pattern.