THERMALLY CONDUCTING AND ELECTRICALLY INSULATING MOLDABLE COMPOSITIONS AND METHODS OF MANUFACTURE THEREOF

摘要

Disclosed herein is a moldable composition, comprising an organic polymer; a filler composition comprising graphite; and boron nitride, wherein the moldable composition has an electrical resistivity greater than or equal to about 10¹³ ohm/sq, wherein the moldable composition has a melt flow index of about 1 to about 30 grams per 10 minutes when measured at a temperature of 280° C. under a load of 16 kgf/cm². Disclosed herein too is a moldable composition, comprising about 30 to about 85 wt % of an organic polymer; a filler composition, comprising about 10 to about 70 wt % graphite; about 5 to about 60 wt % boron nitride; wherein the moldable composition has a thermal conductivity of about 2 to about 6 Watts per meter-Kelvin; and an electrical resistivity greater than or equal to about 10¹³ ohm/sq.