BONDING METHOD OF PROBE

摘要

A bonding method of a probe is provided to utilize data for the bonding process by separately managing data for the unusual condition of probe and probe. The probe(100) is formed with the vertical type or the cantilever type. The probe pad(210) is formed in the substrate(200). The circuit pattern and probe are mounted to the probe pad. The substrate is a space transformer of the multilayer ceramic substrate. The conductivity powder is coated on the probe pad. The probe is arranged on the probe pad to be bonded to the pad.