| 摘要 |
A substrate processing apparatus is provided to improve process efficiency about a bonding apparatus by simultaneously bonding a plurality of substrates. A substrate processing apparatus comprises a chamber(302) and a plurality of jigs(301,310,320,330a,330b,330c,330d,340a,340b,340c,340d). The jigs are parallel provided to the inside of the chamber. One of the first and second substrates are absorbed to one side of one of the adjacent jigs. One of the first and second substrates is absorbed to the other side. |
