LIGHT EMITTING DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

摘要

A light emitting device package and a manufacturing method thereof are provided to reduce the manufacturing cost by equipping the necessary circuit within the LED. A light emitting device package comprises a package body(100), a transistor(120) and an electrode(130). The package body is formed with a semiconductor. The package body has the light emitting device. The transistor is arranged inside the package body. The transistor is connected to the light emitting device. The electrode is connected to the emitting device or the transistor.