| 摘要 |
A semiconductor chip cartridge and bonding apparatus using the same are provided to improve the productivity by increasing the bonding speed by performing a consecutive bonding process. The cartridge body(31) has a pair of winding shafts(33) in the front. The both ends of tape roll(35) are combined each other by a pair of wind-up cores(34). In the tape roll, the tape in which a plurality of semiconductor chips(12) is adhered in the longitudinal direction is wound up. The tension is maintained in the state where the tape roll is reeled in the wind-up core to mount the winding shaft. In the supporting part(36), the edge section(39) is formed in order to be approached to the outer side of the roller(37) for tension.
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