发明名称 |
Semiconductor chip having bond pads and multi-chip package |
摘要 |
A semiconductor chip comprises a semiconductor substrate having integrated circuits formed on a cell region and a peripheral circuit region adjacent to each other. A bond pad-wiring pattern is formed on the semiconductor substrate. A pad-rearrangement pattern is electrically connected to the bond pad-wiring pattern. The pad-rearrangement pattern includes a bond pad disposed over at least a part of the cell region. The bond pad-wiring pattern is formed substantially in a center region of the semiconductor substrate. Thus, with the embodiments of the present invention, the overall chip size can thereby be substantially reduced and an MCP can be fabricated without the problems mentioned above.
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申请公布号 |
US7576440(B2) |
申请公布日期 |
2009.08.18 |
申请号 |
US20060556156 |
申请日期 |
2006.11.02 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
SONG YOUNG-HEE;CHOI IL-HEUNG;KIM JEONG-JIN;SOHN HAE-JEONG;LEE CHUNG-WOO |
分类号 |
H01L23/48;H01L23/52;H01L21/3205;H01L21/822;H01L23/34;H01L23/495;H01L23/525;H01L25/065;H01L27/04 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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