| 摘要 |
A positive resist composition is provided to efficiently cut an acid labile group among chemical amplification type resist materials by very strong sulfonic acid when generating acid by high energy ray irradiation. A positive resist composition comprises a polymer compound (A) containing repeating units represented by chemical formula (a), (b), (c), and (d) as a base resin. In chemical formulas, R^1 independently shows hydrogen atom or methyl group; R^2 shows an acid-labile group; Y is a substituent having a lactone structure; Z is an organic group having a hydroxyl group; R^5, R^6, and R^7 independently, are hydrogen atom or C1-20 linear, branched or cyclic monovalent hydrocarbon group which may contain a hetero atom.
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