| 发明名称 |
Electrically connecting substrate with electrical device |
| 摘要 |
A substrate is electrically connected with an electrical device mounted on the substrate. A ball bond is formed between a first end of a wire and a bonding pad of the substrate. A reverse-motion loop is formed within the wire. A bond is formed between a second end of the wire and a bonding pad of the electrical device.
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| 申请公布号 |
US7576439(B2) |
申请公布日期 |
2009.08.18 |
| 申请号 |
US20080234459 |
申请日期 |
2008.09.19 |
| 申请人 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. |
发明人 |
CRAIG DAVID M.;CHEN CHIEN-HUA |
| 分类号 |
H01L23/52;B23K1/00;B23K1/06;B23K31/02;H01L21/44;H01L23/48;H01L29/40 |
主分类号 |
H01L23/52 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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