发明名称 |
EMI shielded semiconductor package |
摘要 |
An EMI shielded semiconductor package is provided. The package includes a substrate and a chip disposed on the substrate. The chip is electrically connected to the substrate by a plurality of bonding wires. At least one shielding conductive block is formed on the substrate and electrically connected to the ground trace of the substrate. A sealant is formed on the substrate and covers the chip, bonding wires and the shielding conductive block. The sealant has a side surface to expose a surface of the shielding conductive block. A layer of conductive film is formed on the outer surface of the sealant and covers the exposed surface of the shielding conductive block thereby shielding the chip from electromagnetic interference.
|
申请公布号 |
US7576415(B2) |
申请公布日期 |
2009.08.18 |
申请号 |
US20070763858 |
申请日期 |
2007.06.15 |
申请人 |
ADVANCED SEMICONDUCTOR ENGINEERING, INC. |
发明人 |
CHA SANG JIN;KIM HYEONGNO |
分类号 |
H01L23/552 |
主分类号 |
H01L23/552 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|