FULL-ADDITIVE PROCESS FOR A FINE-PITCH PRINTED CIRCUIT BOARD

摘要

A manufacturing method of a fine-pitch PCB is provided to easily form a fine circuit pattern by removing an electrolytic copper plating process and a flash etching process. A hole for an interlayer electric connection is formed on an insulation layer(10) by a drill process. A catalyst(45) for electroless copper plating is formed on a surface of the insulation layer and an inner wall of the hole. A dry film is laminated on the insulation layer. The dry film is selectively removed according to a circuit pattern. The insulation layer is selectively exposed according to the circuit pattern. A chemical copper(40) is formed on a surface of the exposed insulation layer by electroless copper plating. The dry film is removed from the insulation layer.