| 摘要 |
The invention relates to an optoelectronic component comprising a metal core circuit board (5) that has a metal core (6), a dielectric layer (7) that is applied to the metal core (6) and an electrically conductive layer (8) that is applied to the dielectric layer (7), and a chip support (1) that is connected to the metal core circuit board (5). Said chip support (1) has a first main surface (2) on which at least one optoelectronic semi-conductor chip (4) is arranged, and a second surface (3) that is oriented towards the metal core circuit board (5). The chip support (1) on the second main surface (3) is connected to the metal core (6) of the metal core circuit board (5) by means of a soldered connection (12). The dielectric layer (7) and the electrically conductive layer (8) are arranged at a distance from the metal core (6) in the region of soldered connection (12). � KIPO & WIPO 2009 |
