SEMICONDUCTIVE PEELABLE CLOSSLINKED RESIN COMPOSITION AND MANUFACTURED INSULATING CABLE USING THE SAME

摘要

A semiconductive peelable closslinked resin composition is provided to progress crosslinking process without thermal deformation at higher closslinking process temperature and to improve process efficiency and product capacity. A semiconductive peelable closslinked resin composition comprises 100.0 parts by weight of a base resin, 20-80 parts by weight of carbon black based on the base resin, and 0.05-5.0 parts by weight of amide-based lubricant based on the base resin. The base resin comprises 60-80 weight% of an ethylene-based copolymer which is bonded with an unsaturated organic silane and has a melting point of 80‹C or more; 5-20 weight% of an ethylene-acrylic acid copolymer or alkali metal salt thereof; and 5-40 parts by weight of an ethylene propylene copolymer having 5-20 weight% ethylene content or propylene resin 5-40 parts by weight.