STACKED PACKAGE ELEMENT, METHOD FOR FORMING TERMINAL OF STACKED PACKAGE ELEMENT, STACKED PACKAGE, AND METHOD FOR FORMING STACKED PACKAGE

摘要

To provide a semiconductor chip module having high degree of freedom in the assignment of circuit to each semiconductor chip and in the position of connection terminal of each semiconductor chip. A semiconductor chip is provided, on the side face thereof, with a part of connection terminals coupled with a circuit pattern formed on the front face. A plurality of the semiconductor chips are stacked and bonded to produce a semiconductor chip module. The connection terminal portions on the side face of the semiconductor chips are interconnected by a wiring pattern. The connection terminals on the semiconductor chip are led from the front face to the side face and formed by spraying a mist of a conductive material. ® KIPO & WIPO 2009