发明名称 SEMICONDUCTOR DEVICE WITH DEEP TRENCH STRUCTURE AND METHOD OF MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device with a deep trench structure for effectively isolating heavily doped wells of neighboring elements from each other at a high operating voltage. SOLUTION: The semiconductor device with the deep trench structure includes a semiconductor substrate in which a first conductivity type well and a second conductivity type well having opposite types are formed, a gate oxide film and a gate electrode laminated on each of the first conductivity type well and the second conductivity type well, second conductivity type drift regions formed under both sides of the gate electrode in the first conductivity type well, first conductivity type drift regions formed under both sides of the gate electrode in the second conductivity type well, and a first element isolation layer having a trench structure deeper than the first and the second conductivity type wells in order to isolate the first conductivity type well and the second conductivity type well from each other. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009164609(A) 申请公布日期 2009.07.23
申请号 JP20080332175 申请日期 2008.12.26
申请人 MAGNACHIP SEMICONDUCTOR LTD 发明人 LIM YONG GYU;KIM DO HYUNG
分类号 H01L21/76;H01L21/761;H01L21/8238;H01L27/08;H01L27/092 主分类号 H01L21/76
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