| 摘要 |
PROBLEM TO BE SOLVED: To readily discriminate which semiconductor product includes defective semiconductor chips, even if semiconductor products which are encapsulated in batch with MAP sealing are subjected to dicing process. SOLUTION: A resin-encapsulated device 100 seals semiconductor chips 20, mounted at a plurality of places on a substrate 10 together with resin, with the resin-encapsulated device 100 including a marking detector 2 which acquires positional information on a defective chip 20B among the semiconductor chip 20 on the substrate 10 from a defect marking 11 added to the substrate 10, and an ink jet mechanism 3, which adds a defect marking 30, at a position capable of specifying the defective semiconductor chip 20B, even after all the dicing processes are carried out, on the basis of the acquired position information. COPYRIGHT: (C)2009,JPO&INPIT
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