| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide component mounting equipment which can perform effective component mounting by reducing the influence of the time necessary for supplying a bonding auxiliary agent upon the time necessary for component mounting, in component mounting wherein a plurality of projection electrodes formed on the mounting side surface of a component to a substrate are brought into contact with the bonding auxiliary agent, the bonding auxiliary agent is supplied, and the components to which the bonding auxiliary agent has been supplied are mounted on the substrate, when the plurality of components are mounted on the substrate, and to provide a component mounting method. <P>SOLUTION: The bonding auxiliary agent is supplied to a first component out of the plurality of components, and supply of the bonding auxiliary agent to a second component out of the plurality of components is started by the time the first component to which the bonding auxiliary agent has been supplied is completely mounted on the substrate. <P>COPYRIGHT: (C)2009,JPO&INPIT |
