| 摘要 |
PROBLEM TO BE SOLVED: To actualize more effective protection of an electronic component by protection step in cooperation of resin and metal mesh in a mounting substrate provided with loaded electronic components or the like. SOLUTION: The electromagnetic wave shielding resin molding 11 is provided with a metal mesh 32 for core at the core part 31a of a printed circuit board 21 mounting electronic components 41 and is also provided with a metal mesh 39 at a part covering the upper surface and the circumferential surface of the mounted electronic components 41. Moreover, a resin layer 31b and a resin part 61 including these metal meshes 32, 39 are also provided. The resin part 61 is provided directly to cover the mounted electronic components 41. COPYRIGHT: (C)2009,JPO&INPIT
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