| 摘要 |
Methods, systems, and apparatus for programmable selective ablating or cutting of a targeted area of a material with a laser, producing a succession of pulses of the generated radiation with an energy level, pulse duration, and repetition rate specified to ablate or cut the material without causing harmful side effects; and concentrating the radiation pulses on the targeted material to a spot sufficiently small to cause ablating or cutting of the material; and means to direct the said spot to cover the programmed selected targeted area of a material. |
