发明名称 COPPER-TIN ALLOY PLATING FILM, NON-CYANOGEN-BASED COPPER-TIN ALLOY PLATING BATH, AND PLATING METHOD USING THE SAME
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a copper-tin alloy plating film having white appearance and film characteristics similar to those of a nickel plating film, and a non-cyanogen-based copper-tin alloy plating bath for forming the copper-tin alloy plating film. <P>SOLUTION: The copper-tin alloy plating film is composed of a crystal of Cu<SB>6</SB>Sn<SB>5</SB>, the content of tin is specified to≥40 to≤50 vol.%., and that of copper is specified to≥50 to≤60 vol.%. The copper-tin alloy plating film contains≥2 g/L to≤20 g/L bivalent tin salt in terms of bivalent tin ion,≥5 g/L to≤30 g/L bivalent copper ion in terms of bivalent copper salt,≥50 g/L to≤400 g/L inorganic acid,≥2 g/L to≤50 g/L brightening agent,≥0.5 g/L to≤20 g/L lubricant, and≥5 g/L to≤30 g/L quadrivalent tin salt in terms of quadrivalent tin ion, in which pH is≤3, and the brightening agent is an aldehyde-based compound, and the lubricant is formed by using a non-cyanogen-based copper-tin alloy plating bath which is, for example, anionic aryl phenols. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2009161804(A) 申请公布日期 2009.07.23
申请号 JP20070341480 申请日期 2007.12.28
申请人 SHIMIZU:KK 发明人 NISHIMURA TOSHIYUKI;KAWAMOTO KAZUHIKO;SHIMIZU TAKESHI
分类号 C25D3/58;C22C13/00 主分类号 C25D3/58
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