| 摘要 |
PROBLEM TO BE SOLVED: To provide a low-cost multi-layer printed wiring board having high reliability for obtaining high heat dissipation effect without burying a metal plate in the board. SOLUTION: A plurality of wiring layers 1, 3, 5 and 7 are laminated while interposing insulating layers 2, 4 and 6, and protecting solder resists 8 and 9 are provided on the surface of the outer wiring layers 1 and 7, in the printed wiring board. When the solder resists 8 and 9 are formed, over a resin which is a material of the solder resist, metal fillers 10, made by granulating a metal such as an aluminum and copper, etc. which is superior in thermal conductivity, is so buried as to expose its surface protrusively. COPYRIGHT: (C)2009,JPO&INPIT
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