| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer type semiconductor device having enhanced dissipation efficiency of heat generated on respective substrates. SOLUTION: The multilayer type semiconductor device has a plurality of semiconductor chips 12 stacked at intervals, wherein thermally conductive members 16 for improving thermal conductivity between the semiconductor chips 12 are disposed between the semiconductor chips 12. COPYRIGHT: (C)2009,JPO&INPIT
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