发明名称 |
Led chip package structre with a plurality of thick guiding and a method for manufactruing the same |
摘要 |
An LED chip package structure with thick guiding pin includes a plurality of conductive pins separated from each other, an insulative casing, a plurality of LED chips, and a packaging colloid. The insulative casing covers a bottom side of each conductive pin to form an injection concave groove for exposing a top surface of each conductive pin. Two lateral sides of each conductive pin are extended outward from the insulative casing. The LED chips are arranged in the injection concave groove, and each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with different conductive pins. In addition, the packaging colloid is filled into the injection concave groove for covering the LED chips.
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申请公布号 |
US2009186434(A1) |
申请公布日期 |
2009.07.23 |
申请号 |
US20090382760 |
申请日期 |
2009.03.24 |
申请人 |
WANG BILY;CHUANG JONNIE;HUANG HUI-YEN |
发明人 |
WANG BILY;CHUANG JONNIE;HUANG HUI-YEN |
分类号 |
H01L21/50;H01L33/48;H01L33/62 |
主分类号 |
H01L21/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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