发明名称 |
Light-Emitting Diode, Package Structure Thereof and Manufacturing Method for the Same |
摘要 |
A light-emitting diode includes a sapphire substrate, an n-type semiconductor, a light-emitting layer, a p-type semiconductor layer, an anode and a conductive material. The n-type semiconductor layer is formed on the sapphire substrate and has a side surface, a center section and an edge around the center portion. The light-emitting layer is formed on the n-type semiconductor layer. The p-type semiconductor layer is formed on the light-emitting layer. The anode is formed on the p-type semiconductor layer. The conductive material is formed on the bottom surface of the sapphire substrate and is in contact with the n-type semiconductor layer.
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申请公布号 |
US2009184337(A1) |
申请公布日期 |
2009.07.23 |
申请号 |
US20090351011 |
申请日期 |
2009.01.09 |
申请人 |
FAN BEN;WENG HSIN-CHUAN;YEH KUO-KUANG |
发明人 |
FAN BEN;WENG HSIN-CHUAN;YEH KUO-KUANG |
分类号 |
H01L21/04;H01L33/38;H01L51/52 |
主分类号 |
H01L21/04 |
代理机构 |
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