| 摘要 |
<p>A method for treating a bond area of a workpiece, and a method for adhesively bonding workpieces are disclosed. The method for treating a bond area of a workpiece includes cleaning the bond area, activating the bond area, coating at least a portion of the bond area with an adhesion promoter, and chemically transforming the adhesion promoter with an aftertreatment. The method for adhesively bonding workpieces includes cleaning a bond area of a first workpiece, activating the bond area, coating at least a portion of the bond area with an adhesion promoter, chemically transforming the adhesion promoter with an aftertreatment, applying an adhesive to the bond area, bringing the other workpiece into contact with the first workpiece, and curing the adhesive.</p> |
