| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which can be prevented from being a defective product due to bubbles or unfilling of resin in a sealing portion in assembling. <P>SOLUTION: In the semiconductor device, a through-hole h piercing from a first main surface to a second main surface is formed on a metal piece connected to an element region and a second lead 2. With this configuration, a resin injected for resin seal in assembly can easily flow from the first main surface to the second main surface of a metal piece and vice versa to improve filling performance, and bubbles and unfilling of resin easily generated in the lower part of a metal piece can be prevented. In addition, the semiconductor device having low resistance caused by wide width of the metal piece, high heat dissipation and low profile can be obtained. <P>COPYRIGHT: (C)2009,JPO&INPIT |
