发明名称 |
ELEMENT ISOLATION FILM FORMATION METHOD FOR SEMICONDUCTOR MEMORY ELEMENT |
摘要 |
PROBLEM TO BE SOLVED: To provide an element isolation film formation method for a semiconductor memory element for saving process costs, and for improving the reliability of elements. SOLUTION: This element isolation film formation method includes a step of forming a tunnel isolation film and a charge accumulation layer on a semiconductor substrate; a step of forming a trench for element isolation by etching the charge accumulation layer and the tunnel isolation film; a step of forming a protection film on a whole structure including the trench for element isolation; a step of forming the first isolation film on the bottom face of the trench for element isolation; a step of removing the oxidized section of the protection film in the step of forming the first isolation film; and a step of forming a second isolation film on the whole structure including the first isolation film. COPYRIGHT: (C)2009,JPO&INPIT
|
申请公布号 |
JP2009164566(A) |
申请公布日期 |
2009.07.23 |
申请号 |
JP20080209174 |
申请日期 |
2008.08.15 |
申请人 |
HYNIX SEMICONDUCTOR INC |
发明人 |
CHO JONG HYE;CHO WHEE WON;KIN ONSHIYU |
分类号 |
H01L21/76;H01L21/8247;H01L27/115;H01L29/788;H01L29/792 |
主分类号 |
H01L21/76 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|