发明名称 ELEMENT ISOLATION FILM FORMATION METHOD FOR SEMICONDUCTOR MEMORY ELEMENT
摘要 PROBLEM TO BE SOLVED: To provide an element isolation film formation method for a semiconductor memory element for saving process costs, and for improving the reliability of elements. SOLUTION: This element isolation film formation method includes a step of forming a tunnel isolation film and a charge accumulation layer on a semiconductor substrate; a step of forming a trench for element isolation by etching the charge accumulation layer and the tunnel isolation film; a step of forming a protection film on a whole structure including the trench for element isolation; a step of forming the first isolation film on the bottom face of the trench for element isolation; a step of removing the oxidized section of the protection film in the step of forming the first isolation film; and a step of forming a second isolation film on the whole structure including the first isolation film. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009164566(A) 申请公布日期 2009.07.23
申请号 JP20080209174 申请日期 2008.08.15
申请人 HYNIX SEMICONDUCTOR INC 发明人 CHO JONG HYE;CHO WHEE WON;KIN ONSHIYU
分类号 H01L21/76;H01L21/8247;H01L27/115;H01L29/788;H01L29/792 主分类号 H01L21/76
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