发明名称 Resistive memory devices and methods of manufacturing the same
摘要 A resistive memory device includes a first electrode and a first insulation layer arranged on the first electrode. A portion of the first electrode is exposed through a first hole in the first insulation layer. A first variable resistance layer contacts the exposed portion of the first electrode and extends on the first insulation layer around the first hole. A first switching device electrically connects to the first resistive switching layer.
申请公布号 US2009184305(A1) 申请公布日期 2009.07.23
申请号 US20080230223 申请日期 2008.08.26
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE CHANG-BUM;PARK YOUNG-SOO;LEE MYUNG-JAE;WENXU XIANYU;KANG BO-SOO;AHN SEUNG-EON;KIM KI-HWAN
分类号 H01L47/00;H01L21/00 主分类号 H01L47/00
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