发明名称 |
FLUX CREEPING-UP PREVENTIVE COMPOSITION FOR SOLDER, ELECTRONIC MEMBER FOR SOLDER COATED WITH THE COMPOSITION, METHOD FOR SOLDERING THE MEMBER, AND ELECTRICAL APPLIANCE |
摘要 |
<p>Disclosed is a flux creeping-up preventive composition for a solder that has flux creeping-up preventive properties comparable with those of a conventional flux creeping-up preventive agent comprising a polymer containing a polyfluoroalkyl group having 8 or more carbon atoms, wherein an influence on a living body and an environment can be significantly reduced. The flux creeping-up preventive composition comprises a polymer comprising at least one type of an (meth)acrylate polymerization unit (A) containing a perfluoroalkyl group having 6 or less carbon atoms and at least one type of a polymerization unit (B) derived from a hydroxyl group-containing unsaturated compound. The polymer has a weight average molecular weight (in terms of polymethyl methacrylate) of not less than 150000.</p> |
申请公布号 |
WO2009090798(A1) |
申请公布日期 |
2009.07.23 |
申请号 |
WO2008JP71320 |
申请日期 |
2008.11.25 |
申请人 |
AGC SEIMI CHEMICAL CO., LTD.;HIRABAYASHI, RYO;ISHIWATA, FUSAE |
发明人 |
HIRABAYASHI, RYO;ISHIWATA, FUSAE |
分类号 |
B23K35/36;B23K1/00;B23K35/363;B23K101/42;C08F220/24;C08F220/26;H05K3/28;H05K3/34 |
主分类号 |
B23K35/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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