发明名称 FLUID ENCAPSULATED TYPE VIBRATION ISOLATING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a fluid encapsulated type vibration isolating device based on a semiactive system of innovated structure capable of enhancing the reliability of the device including its driver circuit and reducing the labor in the mounting operation, of enhancing the laying efficiency of different leads in the device along with a reduction of the labor in the wiring operation, and of enhancing the reliance upon the electric characteristics and in terms of operation. SOLUTION: A base board 168 for the driver circuit to supply the drive current to a coil 100 is installed in such a manner as pinched in the axial direction by an upper partitioning member 44 and a lower partitioning member 46, which 44 and 46 are positioned at the periphery of the coil 100 and fixed to each other upon being combined together in the axial direction of a cylindrical portion 26 of a second mounting member 14. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009162361(A) 申请公布日期 2009.07.23
申请号 JP20080002781 申请日期 2008.01.10
申请人 TOKAI RUBBER IND LTD 发明人 SAEKI AKIO;KOYAMA HIRONORI
分类号 F16F13/26;F16F13/06;F16F13/18 主分类号 F16F13/26
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