发明名称 ELECTRONIC APPARATUS HOUSING
摘要 PROBLEM TO BE SOLVED: To provide an extrusion-molded electronic apparatus housing, having excellent heat radiation efficiency without increasing the number of components. SOLUTION: A digital camera housing 1 is a cylindrical hollow member formed by extrusion molding using Al alloy, and mainly consists of a wall 10 and a fin 11. The wall 10 has a constant wall-thickness and an approximately rectangular cross-section. The fin 11 is formed over an outer periphery of the wall 10. The fin 11 has a cross-section having a thinner width than a thickness of the wall 10 and a higher height than a thickness of the wall 10, and is formed in a rib-form over the outer periphery face of the wall 10. Thus, a surface area of the digital camera housing 1 increases and a heat generated from the digital camera housing 1 can be efficiently dissipated, because the fin 11 is formed on a surface of the wall 10. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009164455(A) 申请公布日期 2009.07.23
申请号 JP20080002092 申请日期 2008.01.09
申请人 FUJIFILM CORP 发明人 UEDA MASANOBU;ASAKO KOJI
分类号 H05K5/04;G03B17/02;G03B17/56;H04N5/225;H04N101/00;H05K7/20 主分类号 H05K5/04
代理机构 代理人
主权项
地址