| 摘要 |
PROBLEM TO BE SOLVED: To add an attachment module for performing processing for a substrate conveying means, making a substrate stand by, and performing processing on the substrate while suppressing an increase in the occupation area of an apparatus. SOLUTION: A recessed portion 41 is formed in the bottom portion 30 of a vacuum conveyance chamber 3, and the attachment module (cleaning module 4) for cleaning a second conveyance arm is elevated and lowered between a position where the attachment module is stored in the recessed portion 41 so as not to disturb conveyance of a wafer W by the second conveyance arm 32 and a position where the holding region of the second conveyance arm 32 is cleaned in the vacuum conveyance chamber 3. The cleaning module 4 is stored in the recessed portion 41 when not used, and projects into the vacuum conveyance chamber 3 when used, so while an increase in the occupation area of the apparatus is suppressed, the attachment module can be added. COPYRIGHT: (C)2009,JPO&INPIT
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