发明名称 WORKPIECE PROCESSING SYSTEM
摘要 By employing an operating configuration in which delivery modules CV1, CV2 and CV3 for delivering a microplate 2 are coupled to constitute a delivery line and a plurality of working modules A to F for carrying out a work by using the microplate 2 as a target is disposed adjacently to the delivery modules, and furthermore, the modules are connected to a control module 4 through a communication network, a workpiece delivery command to be given to each of the working modules is transmitted to each of the delivery modules through the control module 4, and a delivery enable/disable ascertainment processing is carried out through the communication network without the control module 4 between the respective modules, it is possible to implement both a high throughput obtained by improving a delivery processing efficiency of the microplate and an enhancement in a flexibility of a system structure.
申请公布号 WO2008123594(A3) 申请公布日期 2009.07.23
申请号 WO2008JP56726 申请日期 2008.03.28
申请人 PANASONIC CORPORATION;KITAHARA, HIDEYOSHI;HIGUCHI, AKIRA 发明人 KITAHARA, HIDEYOSHI;HIGUCHI, AKIRA
分类号 G01N35/02;G01N35/00 主分类号 G01N35/02
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