| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device, along with its manufacturing method, by which the problem of creeping up of an underfill is surely prevented in mounting by flip-chip connection. <P>SOLUTION: The semiconductor device includes a plate-like semiconductor chip where a projection-like connection terminal is provided on one surface. On the surface of the semiconductor chip opposite to one surface where the connection terminal is provided, a circumferential edge is removed and a step is provided. Thereby, the volume of a fillet part of the underfill is assured to be larger, improving a function for preventing creeping up of the underfill, thanks to provision of the step on the semiconductor chip. <P>COPYRIGHT: (C)2009,JPO&INPIT |
