| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an inexpensive semiconductor device having high reliability by improving material efficiency while solving the problem that electric characteristics are impaired such as leakage or short-circuit due to variations in connection position of a semiconductor element in assembling. <P>SOLUTION: An uncut strip metal end supplied from a rolled spool to an electrode portion of a semiconductor element connected to a first main surface of a first lead terminal is directly ultrasonically bonded, then an intermediate portion is formed like an arch, the first main surface of a second lead terminal is directly ultrasonically bonded to the arch-shaped final portion and the metal piece is then cut for metal piece manufacturing. This method can prevent the occurrence of a defective product caused by connection failure of a metal piece because of variations in connection position of the semiconductor element, can freely deal with a change in size of a semiconductor element. <P>COPYRIGHT: (C)2009,JPO&INPIT |
