| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a foreign matter inspecting method and a foreign matter inspection device, for a wafer peripheral edge, which can accurately and quantitatively detect at which part of a wafer a defect is present and how large the defect is, and how large the foreign matter is and on which part the foreign matter sticks. <P>SOLUTION: In the foreign matter inspecting method for the wafer peripheral edge wherein the wafer peripheral edge is lit up by a plurality of lighting systems, respective portions of the wafer peripheral edge are imaged by a camera, and imaged images are analyzed to inspect whether foreign matter sticking on the wafer peripheral edge and/or a defect are present, prisms 1 which refract reflected light from the top or the reverse surface of the wafer to the horizontal direction are provided above and below nearby the wafer peripheral edge with the wafer peripheral edge interposed therebetween, and the wafer peripheral edge is inspected by the camera provided on the optical path of the reflected light refracted in the horizontal direction. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
