| 摘要 |
A IC packaging process includes the steps of mounting at least one retaining member on a top side of a substrate, the retaining member defining a receiving space, a chip being mounted to the substrate and located in the receiving space; forming a photo-curing adhesive layer in the receiving space, the photo-curing adhesive layer being capable of shielding the chip completely; irradiating and developing the photo-curing adhesive layer to harden a part of the photo-curing adhesive layer to define a hardened portion thereof, the other part of the photo-curing adhesive layer defining a non-hardened portion corresponding to the chip; and removing the non-hardened portion to expose an active portion of the chip. |
